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HDI 1-30 layer RIgid and flexible pcb with high TG

HDI 1-30 layer RIgid and flexible pcb with high TG
company Xun Jiexing Electronics CO.,Ltd
Categories FPC
Business Type Manufacturer
Update2008-08-28
Original RegionChina
HDI 1-30 layer RIgid and flexible pcb with high TG
Xun Jiexing Co., Ltd. Is a UL & ISO9001: 2000 certified manufactory of Printed Circuit Boards in Shenzhen, China. We focus on the quickturn prototype, small quantity and mass production in HDI PCB( 1-30 layers).
1. HDIPCBs (1-30 Layers)
2. We can provide High frequency board, backplane, thick copper PCB and Metal base board(AI, Cu, Fe).,
3. We can do surface as (lead free) HASL, Immersion Gold, Immersion Tin / silver, Flash Gold, OSP,Hard Gold,Flashed Gold.Hard ENIG+OSP, ENIG+Gold Finger, Flash Gold+HASL, Flash Gold+Gold Finger, Immersion Silver+Gold Finger, Immersion Tin+Gold Finger
4. We can print soldermasker with green, red, yellow, black, bule, white colours.
5. We have perfect sales system and after service system with quick respond and good communication.
We sincerely hope to establish longtime and friendly business relationship with you. Good quality, reasonable price and the 5-Star service are guaranteed.
Features:We can provide you HDI board,BGA board and high technology board,and good service and prompt delivery to you.
Our professional management team, advanced equipments and perfect follow-up service help us improve our reputation among our customers. Customer satisfaction is always what we e pursuing
Our company has passed the ISO9001:2000 certificate by DNV, got US UL certificate and ROSH certificate. Quality is the life of a company. To maintain the best quality is the key to win in the competitive market. We l always try our best to improve our products quality for the benefit of our customers.
Now we have over 200 employees. We have the ability to produce 30-layers PCB. The best aspect ratio we can do is 16:1. We have technology to produce HDI 3 steps blind/buried vias. We e also experienced in producing thicker thickness boards, thicker copper boards, mixed layers, high-frequency boards, high TG boards and high precision impedance controlled boards.
Double sided boards can be done within 24 hours, 4-8 layers boards within 2-5 days. Our quick response always helps us to get more business. Presently we e able to produce over 100 models one day.
Specification:Surface:
Surface Treatment:Tin lead /Leadfree HASL¡¢Flash Gold¡¢ENIG¡¢OSP¡¢Immersion Tin / Silver¡¢Hard Gold;
Selective Surface Treatment:ENIG+OSP, ENIG+Gold Finger, Flash Gold+HASL, Flash Gold+Gold Finger, Immersion Silver+Gold Finger, Immersion Tin+Gold Finger
Capacity:
Layer Count:1-26 Layer (¡14 Layers needs Review)
Bow and Twist :%0.7(¡%0.5needs Process Review)
Min finished size :10mm*10mm
Max finished Size (4L):22.5Inch *33.5 Inch(Needs Review If length exceeds 30 Inch)
Max finished Size (¡6L):22.5Inch*26.5Inch(Needs Review If length exceeds 22.5 Inch)
Multi-press for Blind/Buried Vias:Multi-press Cycle¡3 times(Needs review for 2 cycles pressing)
Max finished Size (Double Sides):23Inch*35Inch(Needs Review If length exceeds 30 Inch)
Finished Board Thickness: 0.20mm-7.0mm(¡0.2mm Needs Review),¡0.4mm for HASL
Finished Board Thickness Tolerance(¡1.0mm):?.1mm
Finished Board Thickness Tolerance(>1.0mm):Material Thickness?0%mm
Unspecified Finished Board Thickness Tolerance( No stack up requirements):Multilayer: ¡2.0mm can?.1mm; 2.0-3.0mm can?.15mm; ¡3.0mm can?.2mm; Double Sides+/-10%m
Reliable Test:
Peel Strength:7.8 N/cm
Flammability:94V-0
Ionic Contamination:¡1 ug/cm2
Min Dielectric Thickness:0.075mm(only for HOZ Base Copper) / 1OZ if copper ground area >80%
Impedance Tolerance:?¦¸(Base Material Type:
Material Type:
High Tg Material----Shengyi Tg>170¡¦
Impedance Control Material:Others need Review ----FR-4,FR-4 HighTg Series
RCC Material:Needs Review----Copper foil thickness 12um,Dielectric Thickness 65,80,100um (After Pressing 55,70,90um)
Prepreg Type:
FR-4 Prepreg¡¢LD-1080( HDI) :7628 2116 1080 3313 106
Copper foil:
Copper Foil:12UM¡¢18UM¡¢35UM¡¢70UM¡¢105UM( Use 70UM base copper, After plating 105UM)
Innerlayer & Outerlayer Image Transfer:
Machine:Scrubbing Machine:0.11-3.2mm,min 9*9inch
Innerlayer Process Capability:
laminator, Exposer:0.11-6.0mm,min 8*8inch,max 24*24inch
Etching Line:0.11-6.0mm,min 7inch*7inch
Min Inner Line Width(18um copper foil,Before Compensation):4mil( 3.5mil needs review)
Min Inner Line Spacing(18um base copper,after compensation):3.5mil
Min Inner Line Width(35um copper foil,Before Compensation):4mil( 3.5mil needs review)
Min Inner Line Spacing(35um base copper,after compensation):3.5mil
Min Inner Line Width(70um copper foil,Before Compensation):5mil
Min Inner Line Spacing(70um base copper,after compensation):6mils( 5mils needs review)
Min Inner Line Width(105um copper foil,Before Compensation):6mils
Min Inner Line Spacing(105um base copper,after compensation):7mils( 6mils needs review)
Min Inner Line Width(140um copper f

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